Guest Editors: Anna Mogilatenko, Catherine Bougerol, Matthias Bickermann, Julita Smalc-Koziorowska, Michael Dudley, Special Section: 19th International Conference on II-VI Compounds and Related Materials. Guest Editors: Emmanuel Guilmeau, Matt Beekman, Franck Gascoin, Yuri Grin, Bertrand Lenoir, Donald Morelli, Takao Mori, Ngo Van Nong, James R. Salvador, David Singh, Tsunehiro Takeuchi, Xinfeng Tang, Chunlei Wan, Hsin Wang, Shanyu Wang, Wenqing Zhang, Tie-Jun Zhu, Special Section: 5th International Conference of Asian Union of Magnetics Societies (IcAUMS). 57–94 (June 2017) Volume 3, Issue 1. pp. 2011 Electronic Materials Conference. Journal of Electronic Materials. Guest Editors: Angel Yanguas-Gil, Ganesh Balakrishnan, Joshua D. Cladwell, Jamie Phillips, Joshua Zide, Michael Tiscler, John Baniecki, Suzanne Mohney, and Shadi Shahedipour-Sandvik, Special Section: 3D Printing. Latest issues. Explore journal content Latest issue All issues. - 85.92.70.121. Special Section: TMS2019 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII. The scope of Journal of Electronic Materials covers Electrical and Electronic Engineering (Q2), Electronic, Optical and Magnetic Materials (Q2), Materials Chemistry (Q2), Condensed Matter Physics (Q3). Guest Editors: Lasse Rosendahl, Donald Morelli, Jihui Yang, Hiroaki Anno, Matt Beekman, Jan D. Koenig, Xinfeng Tang, James R. Salvador, Bertrand Lenoir, Chunlei Wan, Jeff Sharp, Emmanuel Guilmeau, Hsin Wang, Jing-feng Li, Tie-Jun Zhu, David Singh, Ryoji Funahashi, Yuri Grin, and Wenqing Zhang, 2014 Electronic Materials Conference. Guest Editor: Shih-kang Lin, Special Section: U.S. Workshop on Physics and Chemistry of II-VI Materials 2017. It benefits both specialists and non-specialists in the electronic materials field. Effect of Ni Substitution on Optical Transitions and Magnetic Behavior of Mesoporous Ni, Gold-Doped Tin Oxide Film for Highly Sensitive Carbon Monoxide Sensing, Prediction of Magnetocaloric Effects of La, Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration, TMS2020 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder, Asian Consortium AC–CMS International Conference ICMG 2020, Call for Papers: Progress and Challenges with Stability, Sustainability, Toxicity, and Scalability of Perovskite Materials and Devices, Reports on the science and technology of electronic materials, Examines new applications for semiconductors, magnetic alloys, insulators, and optical and display materials, Presents articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials, Publishes select papers from conferences, including the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics, Contains research on specific areas of interest such as materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications, Immediate online access with complete access to all articles, Current Contents Collections / Electronics & Telecommunications Collection, Current Contents/Physical, Chemical and Earth Sciences, EBSCO Applied Science & Technology Source, EBSCO Computers & Applied Sciences Complete, Institute of Scientific and Technical Information of China, Japanese Science and Technology Agency (JST), ProQuest Advanced Technologies & Aerospace Database, ProQuest Materials Science and Engineering Database, Science Citation Index Expanded (SciSearch).

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